Teledyne DALSA’s 16k multi-field TDI camera captures multiple images in a single scan
The Linea HS is ideally suited for applications such as inspection of flat panel displays, printed circuit boards (PCB), and semi-conductor wafers.
Sales & Marketing
Technology / IIoT
WATERLOO — Teledyne DALSA announces that its Linea™ HS 16k Multiﬁeld TDI camera is in volume production. The latest model can capture up to three images simultaneously in a single scan using light sources at different wavelengths.
Its charge-domain CMOS TDI sensor, TDI arrays and a 5×5 μm pixel size, uses 16k x (64+128+64) TDI arrays advanced wafer-level coated dichroic ﬁlters with minimal spectral crosstalk to spectrally isolate the three images. The camera also comes with high-speed CLHS interface, delivering up to 8.4 Gigapixels per second over a single and long length fiber optic cable.
“Advanced multi-field imaging technology is what differentiates the Linea HS 16k Multiﬁeld camera from other line scan cameras,” said Xing-Fei He, Senior Product Manager, Teledyne DALSA in a company press release.
“The dichroic filters overcome spectral crosstalk of traditional colour filters and enable image isolation within the spectral domain.”
The Linea HS 16k Multiﬁeld camera purportedly eliminates the need for multiple scans, thereby boosting inspection system throughout. The Linea HS is ideally suited for applications such as inspection of flat panel displays, printed circuit boards (PCB), and semi-conductor wafers; web inspection of film and metal foil; general purpose machine vision and life science applications.
The camera can also be used for colour imaging with a white light source. The spectral characteristics of dichroic filters provide colour representation that can be used to improve detectability.