POET announces flip-chip DML lasers
The flip-chip assembly technique enables a true single-chip, fully integrated Optical Engine to be produced at wafer-scale.
TORONTO — POET Technologies Inc., announced on Dec. 17 that it has completed and tested its high-speed Directly Modulated Laser (DML) designs using a distributed feedback (DFB) structure and successfully “flip-chipped” these lasers onto the Company’s Optical Interposer platform.
The flip-chip assembly technique enables a true single-chip, fully integrated Optical Engine to be produced at wafer-scale, resulting in the lowest-cost, smallest-size 100G CWDM4 Optical Engine with a form factor of 9mm x 6mm.
“Without being able to flip-chip the lasers, we would be unable to assemble Optical Engines at wafer-scale, which is the single most important driver of cost. Wafer-scale processing enables the production of high unit volumes at low incremental costs, ultimately allowing us to reduce the cost of building photonics devices by 25% to 40% compared to conventional approaches,” stated Suresh Venkatesan, Chairman and CEO of POET.
Flip-chip assembly of electronic devices on circuit boards, MEMS (Microelectromechanical Systems) and other devices is an advanced manufacturing process for achieving electrical interconnect (often referred to as 2-D, 2.5-D and 3-D) in semiconductor architectures.