Intlvac ships material to the EU for quantum computing

HALTON HILLS — Intlvac Thin Film, a Canadian advanced manufacturing company that has a thirty-year history in the thin film deposition and materials science industry has begun shipping its Indium Bump Deposition Systems to customers in Europe.

Intlvac’s Indium Bump Deposition Systems find applications in the quantum computing market. Additional commercial applications of the Indium Solder Bump Deposition System include; Indium bump bonding for fabrication of focal plane arrays, ohmic contacts for III-V and II-VI materials, precision optical coatings by ion beam and magnetron sputtering, optical filters, gratings, anti-reflective and anti-scratch coatings for IR optics, semiconductors, dielectric materials and superconductors.

The Intlvac Indium Solder Bump Deposition System is optimized for high throughput production with low maintenance and quick turnaround on parts. From pushing the “go” button to pulling out a finished wafer takes less than 90 minutes making it ideal for high volume markets.

“Intlvac invested heavily in research and development over the last few years and are starting to see the returns on that investment. We continue to see massive growth for our reactive sputtering optical coatings, diamond like carbon (DLC) and our chip delayering systems for the defence industry,” explained Dino Deligiannis the President of Intlvac Thin Films. “For the quantum computing market we have systems commercially available and we ship our Indium Bump Deposition Systems to Europe this month. In addition to the investment in research and development we added people and capacity to build more of our systems.”