Canadian Manufacturing

SEMI reports that global 300mm fab equipment spending is expected to total $374B over the next three years

October 9, 2025 
by CM Staff

Manufacturing Exporting & Importing Financing Research & Development Sales & Marketing Technology / IIoT Electronics

This investment reportedly reflects fab regionalization and a surging AI chip demand for data centres and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

300mm Equipment Spending

PHOENIX — Global 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported in its latest 300mm Fab Outlook. This investment reportedly reflects fab regionalization and a surging AI chip demand for data centres and edge devices, while underscoring the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Worldwide 300mm fab equipment spending is expected to surpass $100 billion for the first time in 2025, growing 7% to $107 billion. The report projects investment will increase 9% to $116 billion in 2026, 4% to $120 billion in 2027, and 15% to $138 billion in 2028.

“The semiconductor industry is entering a pivotal era of transformation, driven by unprecedented demand for AI-enabled technologies and a renewed focus on regional self-sufficiency,” said Ajit Manocha, President and CEO of SEMI. “Strategic global investments and collaboration are driving robust, advanced supply chains and faster deployment of next-generation semiconductor manufacturing technologies. The global expansion of 300mm fabs will enable progress in data centres, edge devices, and the digital economy.”

Advertisement

According to SEMI in a press release, the Logic & Micro segment is projected to lead equipment expansion with $175 billion in total investments from 2026 to 2028. Foundries are also expected to be the primary drivers of this growth, fuelled by sub-2nm capacity build-outs. Key enablers include advanced technologies such as gate-all-around (GAA) architecture and backside power delivery, which are essential to enhancing chip performance and power efficiency for increasingly demanding AI workloads.

The Memory segment is projected to rank second with $136 billion in spending over the three-year period, marking the beginning of a new growth cycle for the segment, according to SEMI. DRAM-related equipment investment is also expected to exceed $79 billion from 2026 to 2028, with 3D NAND investment reaching $56 billion over the same period. AI training and inference have driven comprehensive demand increases across various types of memory.

SEMI also stated that China is expected to continue to lead in 300mm equipment spending with $94 billion in projected investments from 2026 to 2028, sustained by national self-sufficiency policies.

Korea is projected to rank second in global 300mm equipment spending over the three-year period with $86 billion invested, supporting industries worldwide in generative AI demand, according to SEMI data.

Advertisement

The report projects the Americas to invest $60 billion from 2026 to 2028, rising to fourth position. U.S. suppliers are expanding advanced process capacity to meet rising AI application demands while catalyzing domestic industrial and investment upgrades to maintain global technology development leadership.

Advertisement

Stories continue below